Protective device for the laser machining of holes in components
US9457430B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 21, 2012 |
| Grant date | Oct 4, 2016 |
| Priority date | — |
| Expiry date | Sep 24, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24994
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The invention relates to a protective device (1) for the laser machining of holes (3) in at least one component (2) by means of a laser beam (5), wherein the protective device (1) is positionable in the beam direction downstream of the beam-exit-side end (8) of a hole (3) to be machined in the component wall (10), in order to protect an adjoining rear space having a component wall (11), opposite the hole (3), of the component (2) from the incident laser beam. The protective device (1) according to the invention is formed from a composite made of a matrix composed of polyether ether ketone plastics material and fibers embedded therein, wherein the fibers are embedded such that, with respect to their particular fiber extending direction, they extend in a criss-cross manner in the plastics material and are distributed at approximately the same density in the volume of the plastics material of the protective device (1). The fibers are configured as glass fibers or carbon fibers in order to split the laser beam (5) passing into the composite and to reduce the energy density thereof.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.