Heat-resistant SAN resin, method for manufacturing same, and heat-resistant ABS resin composition comprising same
US9458313B2 · kind B2 · utility
2Cited by
5References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 27, 2014 |
| Grant date | Oct 4, 2016 |
| Priority date | — |
| Expiry date | Feb 27, 2034 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L55/02
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Disclosed are a heat-resistant SAN resin, a method of preparing the same, and a heat-resistant ABS resin composition comprising the same. More particularly, a heat-resistant SAN resin comprising 60 to 75 wt % of α-methylstyrene, 25 to 35 wt % of a vinyl cyan compound, and 0 to 10 wt % of an aromatic vinyl compound (except for α-methylstyrene), the heat-resistant SAN resin having a degree of branching of 0.40 to 0.60, a molecular weight of 90,000 to 150,000 g/mol, and a glass transition temperature (Tg) of 124 to 140° C., a method of preparing the same, and a heat-resistant ABS resin composition comprising the same are disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.