Method and devices for controlling a vapour flow in vacuum evaporation
US9458533B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Dec 22, 2008 |
| Grant date | Oct 4, 2016 |
| Priority date | — |
| Expiry date | Aug 5, 2031 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C14/24
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The invention relates to a method and a device for the coating of running substrates (25) moving along a run direction through a treatment zone (6), in which the vapor of a coating material is generated in a chamber (5), this vapor passing through a treatment aperture towards the treatment zone (6) where the coating material condenses on the surface of the substrates (25). The vapor flow through the treatment aperture is controlled by adjusting the extent to which the treatment aperture is shut off by at least one shutter (13), between an open position, in which said vapor flows through the treatment aperture towards the treatment zone (6), and a closed position, in which the vapor is prevented from flowing towards the treatment zone (6) through the treatment aperture.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.