Methods for deposition of materials including mechanical abrasion

US9459222B2 · kind B2 · utility

Assignee

• Massachusetts Institute of Technology · US

Inventors

• Timothy M. Swager · Newton, US
• Katherine A. Mirica · Hanover, US
• Joseph Michael Azzarelli · Cambridge, US
• Jonathan G. Weis · Bear, US
• Jan M. Schnorr · Cambridge, US
• Birgit Esser · Cambridge, US

Key dates

• Filing date: Mar 13, 2013
• Grant date: Oct 4, 2016
• Expiry date: May 22, 2033

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T29/49002
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

Methods described herein may be useful in the fabrication and/or screening of devices (e.g., sensors, circuits, etc.) including conductive materials. In some embodiments, a conductive material is formed on a substrate using mechanical abrasion. The methods described herein may be useful in fabricating sensors, circuits, tags for remotely-monitored sensors or human/object labeling and tracking, among other devices. In some cases, devices for determining analytes are also provided.