Measurement of properties of sample of curing compositions under high pressure
US9459245B2 · kind B2 · utility
2Cited by
33References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 11, 2011 |
| Grant date | Oct 4, 2016 |
| Priority date | — |
| Expiry date | Feb 14, 2033 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N33/383
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method for testing a curing composition, comprising includes a curing composition; injecting the curing composition into a mold; curing the curing composition into a cured composition, in the mold at a controlled curing pressure; measuring at least one physical or mechanical property of the cured sample at a controlled test pressure, in the mold; the mold being rigid relatively to the cured sample during the curing step.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.