Package for housing optical semiconductor element and optical semiconductor device
US9459416B2 · kind B2 · utility
1Cited by
4References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 28, 2014 |
| Grant date | Oct 4, 2016 |
| Priority date | — |
| Expiry date | Feb 10, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S5/02251
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A package for housing an optical semiconductor element includes a base body having an optical semiconductor element mounting portion on an upper main surface thereof; a frame body joined to the base body so as to surround the mounting portion; and an optical fiber securing member fitted in a through hole which penetrates through the frame body. The frame body is formed by bending a single strip-like plate member at its several positions, and then bonding one end side and an other end side thereof, the through hole being provided so as to be located at a juncture of the one end side and the other end side.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.