RFID integrated circuits with large contact pads
US9460380B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 4, 2014 |
| Grant date | Oct 4, 2016 |
| Priority date | — |
| Expiry date | Aug 4, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49016
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Technologies are generally directed to assembly of a Radio Frequency Identification (RFID) tag precursor. An assembly may be provided, the assembly having an RFID integrated circuit (IC), a nonconductive repassivation layer on a surface of the IC and confined within a perimeter of the surface, and a conductive redistribution layer on the repassivation layer and confined within the perimeter of the surface, in which a first portion of the redistribution layer is electrically connected to the IC through a first electrical connection. A substrate having a first antenna terminal to the assembly may be attached with an adhesive, and at least a first portion of a nonconductive barrier present on at least one of the first antenna terminal and the first portion of the redistribution layer may be reacted with a reactant to make the first portion of the nonconductive barrier conductive. A second electrical connection may then be formed between the first antenna terminal and the first portion of the redistribution layer through the first portion of the nonconductive barrier.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.