Fan-out PoP structure with inconsecutive polymer layer
US9461018B1 · kind B1 · utility
604Cited by
10References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 17, 2015 |
| Grant date | Oct 4, 2016 |
| Priority date | — |
| Expiry date | Apr 17, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3511
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A package includes a device die, a molding material molding at least a portion of the device die therein, and a through-via substantially penetrating through the molding material. The package further includes a dielectric layer contacting the through-via and the molding material, and a die attach film attached to a backside of the device die. The die attach film includes a portion extending in the dielectric layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.