Manufacturing method for a piezoelectric layer arrangement and corresponding piezoelectric layer arrangement

US9461234B2 · kind B2 · utility

Assignee

• Robert Bosch GmbH · DE

Inventors

• Thomas Mayer · Reutlingen, DE
• Juergen Butz · Aspach, DE
• Rainer Straub · Entringen, DE
• Jochen Tomaschko · Herrenberg, DE
• Christof Single · Tübingen, DE

Key dates

• Filing date: Jul 30, 2015
• Grant date: Oct 4, 2016
• Expiry date: Jul 30, 2035

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10N30/883

Abstract

A manufacturing method is provided for a piezoelectric layer arrangement and a corresponding piezoelectric layer arrangement. The manufacturing method includes the steps: depositing a first electrode layer on a substrate; depositing a first insulating layer on the first electrode layer; forming a through opening in the first insulating layer to expose the first electrode layer within the through opening; depositing a piezoelectric layer on the first insulating layer and on the first electrode layer within the through opening; back-polishing the resulting structure to form a planar surface, on which a piezoelectric layer area, surrounded by the first insulating layer, is exposed; and depositing and structuring a second electrode layer on the first insulating layer, which contacts the piezoelectric layer area.