Anti-impact silicon based MEMS microphone, a system and a package with the same
US9462389B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Aug 6, 2013 |
| Grant date | Oct 4, 2016 |
| Priority date | — |
| Expiry date | Mar 16, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04R2307/023
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention relates to an anti-impact silicon based MEMS microphone, a system and a package with the same, the microphone comprises: a silicon substrate provided with a back hole therein; a compliant diaphragm supported on the silicon substrate and disposed above the back hole thereof; a perforated backplate disposed above the diaphragm with an air gap sandwiched in between, and further provided with one or more first thorough holes therein; and a stopper mechanism, including one or more T-shaped stoppers corresponding to the one or more first thorough holes, each of which has a lower part passing through its corresponding first thorough hole and connecting to the diaphragm and an upper part being apart from the perforated backplate and free to vertically move, wherein the diaphragm and the perforated backplate are used to form electrode plates of a variable condenser.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.