Power semiconductor device
US9462708B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Mar 26, 2015 |
| Grant date | Oct 4, 2016 |
| Priority date | — |
| Expiry date | Mar 26, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/14329
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A power semiconductor device comprising: a body, a substrate and power semiconductor components arranged on and connected to the substrate. The device has electrically conductive load connection elements and an integrally formed housing which runs laterally around the components. The body has a main outer surface which runs laterally around the components and which is at least partially covered by an elastic, electrically nonconductive, integrally formed, structured sealing element which runs laterally around the components. A section of the sealing element is arranged between the housing and the main outer surface of the body. The housing and the main outer surface of the body are pressed against the sealing element, which seals off the housing from the main outer surface of the body. The invention provides a compact device whose load connection elements are reliably electrically insulated from the body and whose housing is reliably sealed off from the body.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.