Laser systems and methods for internally marking thin layers, and articles produced thereby
US9463528B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 15, 2014 |
| Grant date | Oct 11, 2016 |
| Priority date | — |
| Expiry date | Jan 4, 2035 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24802
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Laser output (114) is employed to mark an article (100) including a layer (104) supported by a substrate (102), wherein the layer (104) has a thickness (t) that is less than or equal to 50 microns. The laser output (114) is focused to a numerical aperture diffraction-limited spot size (32) of less than or equal to 5 microns at a focal point (80) of the beam waist (90) and directed into the layer (104) to form a plurality of structures comprising a plurality of laser-induced cracks within the layer (104) and within a region of the article (100), wherein the laser-induced cracks terminate within the layer (104) without extending to the substrate (102) or an outer surface (108) of the layer (104), and wherein the plurality of structures are configured to scatter light incident upon the article (100).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.