Low-temperature nanosolders
US9463532B2 · kind B2 · utility
3Cited by
2References
4Claims
0Family size
Assignee
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Key dates
| Filing date | Oct 5, 2015 |
| Grant date | Oct 11, 2016 |
| Priority date | — |
| Expiry date | Oct 5, 2035 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB32B15/018
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A nanosolder comprises a first metal nanoparticle core coated with a second metal shell, wherein the first metal has a higher surface energy and smaller atomic size than the second metal. For example, a bimetallic nanosolder can comprise a protective Ag shell “glued” around a reactive Cu nanoparticle. As an example, a 3-D epitaxial Cu-core and Ag-shell structure was generated from a mixture of copper and silver nanoparticles in toluene at temperatures as low as 150° C.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.