Method of manufacturing chemical mechanical polishing layers
US9463553B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 19, 2014 |
| Grant date | Oct 11, 2016 |
| Priority date | — |
| Expiry date | Jul 20, 2034 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24D11/008
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method of making a polishing layer for polishing a substrate is provided, comprising: providing a liquid prepolymer material; providing a plurality of hollow microspheres; exposing the plurality of hollow microspheres to a vacuum to form a plurality of exposed hollow microspheres; treating the plurality of exposed hollow microspheres with a carbon dioxide atmosphere to form a plurality of treated hollow microspheres; combining the liquid prepolymer material with the plurality of treated hollow microspheres to form a curable mixture; allowing the curable mixture to undergo a reaction to form a cured material, wherein the reaction is allowed to begin ≦24 hours after the formation of the plurality of treated hollow microspheres; and, deriving at least one polishing layer from the cured material; wherein the at least one polishing layer has a polishing surface adapted for polishing the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.