Composite structures using interpenetrating polymer network adhesives
US9464217B2 · kind B2 · utility
0Cited by
7References
20Claims
0Family size
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Inventor
Key dates
| Filing date | Dec 16, 2013 |
| Grant date | Oct 11, 2016 |
| Priority date | — |
| Expiry date | Dec 21, 2034 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2312/00
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A composition is provided that consists essentially of a first polymer system and a second polymer system. The first polymer system has a first modulus of about 180 ksi to about 335 ksi. The first polymer system consists essentially of a thermosetting acrylate. The second polymer system consists essentially of a thermosetting epoxy system and an epoxy curing agent. The thermosetting epoxy system comprises a first epoxy.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.