Method of fabricating light-scattering substrate
US9464351B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 3, 2014 |
| Grant date | Oct 11, 2016 |
| Priority date | — |
| Expiry date | Jun 3, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K50/854
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method of fabricating a light-scattering substrate, a light-scattering substrate fabricated by the same method, and an organic light-emitting device (OLED) including the same light-scattering substrate, in which a light-scattering layer of the light-scattering substrate can improve a light extraction efficiency. The method fabricates the light-scattering substrate by chemical vapor deposition, and includes loading a base substrate into a chamber, and forming a light-scattering layer on the base substrate by supplying a Ti source and an oxidizer including H2O into the chamber. In the process of forming the light-scattering layer, the mole ratio of the H2O with respect to the Ti is 10 or greater.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.