Assembling method and maintaining method for vertical probe device
US9465050B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 10, 2015 |
| Grant date | Oct 11, 2016 |
| Priority date | — |
| Expiry date | May 5, 2035 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49895
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An assembling method for a vertical probe device includes steps of disposing a lower die on a jig by inserting supporting columns through jig holes of the lower die, fastening a positioning film on the supporting columns, installing probe needles and an upper die in a way that the positioning film is located between the upper and lower dies without contacting the upper die, unfastening the positioning film, and removing the jig so that the upper and lower dies, positioning film and probe needles constitute the device. A maintaining method for the device includes steps of inserting the supporting columns through the jig holes, fastening the positioning film to the jig, and removing the upper die. The probe needles and upper die are easily removed and installed and the probe needles are reliable. The vertical probe device is applicable for accommodating electronic components on the top thereof.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.