OLED packaging method and structure
US9466809B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 11, 2014 |
| Grant date | Oct 11, 2016 |
| Priority date | — |
| Expiry date | Nov 26, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K2102/351
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention provides an OLED packaging method and structure. The method includes the following steps: providing an OLED substrate (1) and a package cover (4) and forming an alignment mark on the package cover (4); forming a circle of patternized desiccant layer (3) on the package cover (4); coating a circle of frame resin (5) on the package cover (4) at an outer side of the desiccant layer (3); attaching the package cover (4) and the OLED substrate (1) to each other; and subjecting the frame resin (5) to irradiation of a UV light source or heating for curing so as to complete packaging of the OLED substrate (1) with he package cover (4).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.