Method and apparatus for implementing optical modules in high temperatures
US9468085B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Dec 19, 2013 |
| Grant date | Oct 11, 2016 |
| Priority date | — |
| Expiry date | Jul 29, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/4913
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
An optical module apparatus and method operates at high temperatures. The apparatus has a first printed circuit board with optoelectronics and electronics located on a thermoelectric cooler. The thermoelectric cooler is located on a second printed circuit board that also has electronics that control the thermoelectric cooler separately mounted thereon. The optical module operates at substantially higher temperatures by placing the optoelectronics and the electronics, not including the thermoelectric cooler controller, on the thermoelectric cooler. The electronics controlling the thermoelectric cooler only require relatively simple, low-speed electronics that are implemented in integrated circuit technologies. The integrated circuit electronics may operate at very high temperatures (200° C. or higher) thereby making control of the thermoelectric cooler with uncooled electronics possible.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.