Monolithic multi-module electronics chassis with multi-planar embedded fluid cooling channels
US9468131B2 · kind B2 · utility
9Cited by
12References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 16, 2014 |
| Grant date | Oct 11, 2016 |
| Priority date | — |
| Expiry date | Aug 5, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K13/00
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A cooling system for cooling a heat source includes a monolithic structure having a plurality of embedded cooling channels arranged in a multi-planar arrangement, the embedded cooling channels configured to carry a cooling fluid to a plurality of locations throughout the monolithic structure, the cooling fluid configured to absorb heat transferred from a heat source associated with the monolithic structure. The monolithic structure is formed integrally with the embedded cooling channels using an additive manufacturing process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.