Modular cooling system
US9468133B2 · kind B2 · utility
0Cited by
3References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 20, 2015 |
| Grant date | Oct 11, 2016 |
| Priority date | — |
| Expiry date | May 9, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An exemplary modular cooling system for cooling a plurality of electronic components is provided. The cooling system includes a plurality of cooling modules and a clamping arrangement. Each cooling module includes an evaporator unit, a condenser, a first pipe system, and a second pipe system. The clamping arrangement is adapted for holding and pressing an alternation stack in which the evaporator units are stacked in alternation with the power electronic components.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.