Patent · US Active

Method and device for machining non-rotationally symmetrical workpieces by means of laser beam

US9468992B2 · kind B2 · utility

0Cited by
4References
5Claims
0Family size

Assignee

Inventors

Key dates

Filing dateSep 26, 2013
Grant dateOct 18, 2016
Priority date
Expiry dateOct 24, 2033

Classification

  • Technology area (CPC B)Performing Operations; Transporting
  • CPC primaryB23K2101/06
  • WIPO fieldMachine tools
  • WIPO sectorMechanical engineering

Abstract

A device and a method for machining workpieces (5, 6) by means of a laser beam. Said device has a delivery means (3) for delivering the workpieces (5,6) to a first machining position (8.1) and a machining means (2) which has at least one machining head (2.1) for machining of a workpiece (5,6) delivered to the first machining position (8.1). The delivery means (3) is a gripping robot with a gripping device (3.2). At least one clamping means (9,10) is disposed in order to accommodate a workpiece (5,6) delivered by the delivery means (3), wherein respective machining position is defined by each clamping means (9,10). The machining head (2.1) can be delivered to each machining position for machining of the workpieces (5,6).

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.