Method and device for machining non-rotationally symmetrical workpieces by means of laser beam
US9468992B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 26, 2013 |
| Grant date | Oct 18, 2016 |
| Priority date | — |
| Expiry date | Oct 24, 2033 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2101/06
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A device and a method for machining workpieces (5, 6) by means of a laser beam. Said device has a delivery means (3) for delivering the workpieces (5,6) to a first machining position (8.1) and a machining means (2) which has at least one machining head (2.1) for machining of a workpiece (5,6) delivered to the first machining position (8.1). The delivery means (3) is a gripping robot with a gripping device (3.2). At least one clamping means (9,10) is disposed in order to accommodate a workpiece (5,6) delivered by the delivery means (3), wherein respective machining position is defined by each clamping means (9,10). The machining head (2.1) can be delivered to each machining position for machining of the workpieces (5,6).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.