Thermal inkjet printhead stack with amorphous metal resistor
US9469107B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 12, 2013 |
| Grant date | Oct 18, 2016 |
| Priority date | — |
| Expiry date | Jul 12, 2033 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J2202/11
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
The present disclosure is drawn to a thermal inkjet printhead stack with an amorphous metal resistor, including an insulated substrate and a resistor applied to the insulated substrate. The resistor can include from 5 atomic % to 90 atomic % of a metalloid of carbon, silicon, or boron; and from 5 atomic % to 90 atomic % each of a first and second metal of titanium, vanadium, chromium, cobalt, nickel, zirconium, niobium, molybdenum, rhodium, palladium, hafnium, tantalum, tungsten, iridium, or platinum, where the second metal is different than the first metal. The metalloid, the first metal, and the second metal can account for at least 70 atomic % of the amorphous thin metal film.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.