Low emission epoxy curing agents
US9469721B2 · kind B2 · utility
1Cited by
2References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 11, 2013 |
| Grant date | Oct 18, 2016 |
| Priority date | — |
| Expiry date | Dec 11, 2033 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08K2201/014
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A hardener composition comprising: a) an amine component; and b) a glycol ether component comprising i) from 10 weight percent to 70 weight percent alkylene glycol phenyl ether; ii) from 25 weight percent to 80 weight percent dialkylene glycol phenyl ether; iii) from 5 weight percent to 20 weight percent trialkylene glycol phenyl ether, is disclosed. The hardener composition can be used in epoxy thermoset formulations.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.