Patent · US Active

Low emission epoxy curing agents

US9469721B2 · kind B2 · utility

1Cited by
2References
19Claims
0Family size

Assignee

Inventors

Key dates

Filing dateDec 11, 2013
Grant dateOct 18, 2016
Priority date
Expiry dateDec 11, 2033

Classification

  • Technology area (CPC C)Chemistry; Metallurgy
  • CPC primaryC08K2201/014
  • WIPO fieldMacromolecular chemistry, polymers
  • WIPO sectorChemistry

Abstract

A hardener composition comprising: a) an amine component; and b) a glycol ether component comprising i) from 10 weight percent to 70 weight percent alkylene glycol phenyl ether; ii) from 25 weight percent to 80 weight percent dialkylene glycol phenyl ether; iii) from 5 weight percent to 20 weight percent trialkylene glycol phenyl ether, is disclosed. The hardener composition can be used in epoxy thermoset formulations.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.