Nickel phosphorous CMP compositions and methods
US9469787B2 · kind B2 · utility
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28Claims
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Key dates
| Filing date | Oct 13, 2015 |
| Grant date | Oct 18, 2016 |
| Priority date | — |
| Expiry date | Oct 13, 2035 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/11
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A chemical mechanical polishing (CMP) composition for planarizing a nickel phosphorus (NiP) substrate comprises a suspension of colloidal silica particles and fused silica particles in an acidic aqueous carrier containing hydrogen peroxide, in which the concentration of the fused silica particles is less than or equal to the concentration of the colloidal silica particles. In some embodiments, the CMP composition includes a primary complexing agent, a secondary complexing agent, and a metal ion such as ferric ion, which is capable of reversible oxidation and reduction in the presence of hydrogen peroxide and NiP.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.