Heat-actuated release mechanism
US9470213B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 16, 2012 |
| Grant date | Oct 18, 2016 |
| Priority date | — |
| Expiry date | Jul 25, 2034 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF16B2200/77
- WIPO fieldEngines, pumps, turbines
- WIPO sectorMechanical engineering
Abstract
A release mechanism passively releases a mechanical coupling as a result of a temperature rise. The release mechanism includes a breakable element, such as a shape memory alloy (SMA) element, that is configured to break when the element is heated to a predetermined temperature. The breakage of the breakable element releases a mechanical coupling, such as a coupling holding a lid onto a container. The release mechanism may be part of a handle or other device to close the container. The release mechanism may have a mechanical load on it prior to release, a load that in part passes through the breakable element. Most of the load may pass through one or more other members of the release mechanism, providing the force for separation after the release mechanism is triggered. The release mechanism may be used to provide a passive way of releasing a mechanical coupling in response to heating.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.