Microlens array, image pickup element package, and method for manufacturing microlens array
US9470820B2 · kind B2 · utility
0Cited by
0References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 23, 2015 |
| Grant date | Oct 18, 2016 |
| Priority date | — |
| Expiry date | Jan 23, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
The present invention relates to a microlens array comprising a transparent substrate, a resin layer provided on/above at least one surface of the transparent substrate, containing a photosensitive resin and forming a plurality of microlenses, and a functional layer reflecting at least light for reacting the photosensitive resin, the functional layer is formed on a surface of the transparent substrate at a side on which the resin layer is not formed, or on the surface of the transparent substrate at the side on which the resin layer is formed and at a position nearer the transparent substrate than the resin layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.