Flexible electronic package integrated heat exchanger with cold plate and risers
US9472487B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 26, 2012 |
| Grant date | Oct 18, 2016 |
| Priority date | — |
| Expiry date | Apr 6, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15311
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
In some embodiments, a semiconductor cooling apparatus includes a heat exchanger configured to thermally couple to a semiconductor element to transfer heat to coolant flowing through the heat exchanger. The apparatus also includes a flexible coolant supply manifold and a flexible coolant return manifold. The flexible coolant supply manifold and flexible coolant return manifold flex to conform to a height of the semiconductor element to apply a force to maintain the thermal coupling between the heat exchanger and the semiconductor element. The apparatus also includes a cold plate located under the semiconductor element, the cold plate configured to couple to the flexible coolant supply manifold via a first riser to provide coolant to the flexible coolant supply manifold and configured to couple to the flexible coolant return manifold via a second riser to exhaust returned coolant to the cold plate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.