Die or substrate marking using a laser
US9472505B2 · kind B2 · utility
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16Claims
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Assignee
Inventors
Key dates
| Filing date | Dec 12, 2013 |
| Grant date | Oct 18, 2016 |
| Priority date | — |
| Expiry date | Dec 12, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Apparatus, systems, and methods are provided to generate markings on the surface of a die or substrate. The markings represent information. The markings can be annealed onto the surface of the die or substrate using a laser. Another embodiment can use an out-of-focus laser beam to mark a solder resist material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.