Light emitting diode package and lighting device using the same
US9472740B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 2, 2015 |
| Grant date | Oct 18, 2016 |
| Priority date | — |
| Expiry date | Feb 2, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
Abstract
A light emitting diode (LED) package may include a package body provided with a pair of lead frames, and an LED chip mounted on the package body and electrically connected to the lead frames through wire bonding. Each lead frame may include a first reflective layer disposed on a mounting surface on which the LED chip is disposed and a second reflective layer disposed on the first reflective layer. A wire may penetrate through the second reflective layer to be connected to the first reflective layer. Accordingly, the LED package may provide the uniform amount of light by suppressing discoloration of the lead frames, and the manufacturing time of the LED package may be reduced, leading to a reduction in manufacturing costs.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.