Light emitting diode package
US9472743B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 30, 2015 |
| Grant date | Oct 18, 2016 |
| Priority date | — |
| Expiry date | Dec 30, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/8582
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A light-emitting diode package includes a package body and a light-emitting diode chip disposed on the package body. The package body includes upper conductive patterns disposed on an upper insulation substrate, a lower insulation substrate disposed on lower conductive patterns, and middle conductive patterns disposed between the upper insulation substrate and the lower insulation substrate. The package body also includes upper vias electrically connecting each of the upper conductive patterns to each of the middle conductive patterns, respectively, the upper vias being disposed in the upper insulation substrate, and lower vias electrically connecting each of the middle conductive patterns to each of the lower conductive patterns, respectively, the lower vias disposed in the lower insulation substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.