Radio frequency grounding sheet for a phased array antenna
US9472843B2 · kind B2 · utility
6Cited by
8References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 1, 2013 |
| Grant date | Oct 18, 2016 |
| Priority date | — |
| Expiry date | Apr 9, 2035 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49016
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
A method includes coupling a printed circuit board (PCB) and a first conductive sheet to a pressure plate to form an antenna sub-assembly. The first conductive sheet defines a first plurality of openings and includes a first plurality of bumps. At least one opening of the first plurality of openings is surrounded by a set of bumps of the first plurality of bumps. The method includes coupling the antenna sub-assembly to a cover to form an antenna assembly.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.