Laser component and method for the production thereof
US9472923B2 · kind B2 · utility
1Cited by
8References
12Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Mar 25, 2014 |
| Grant date | Oct 18, 2016 |
| Priority date | — |
| Expiry date | Mar 25, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S5/02208
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A laser component includes a carrier having a lens carrier surface and a chip carrier surface raised relative to the lens carrier surface, wherein an optical lens is arranged on the lens carrier surface, a laser chip is arranged on the chip carrier surface, the chip carrier surface and the lens carrier surface are formed by materially uniformly continuous sections of the carrier, the carrier includes a plastic material, and the laser component is configured as a surface-mountable SMD component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.