Method of manufacturing electronic device and electronic device
US9474180B2 · kind B2 · utility
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5References
8Claims
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Inventor
Key dates
| Filing date | Aug 8, 2013 |
| Grant date | Oct 18, 2016 |
| Priority date | — |
| Expiry date | Sep 23, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49117
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of manufacturing an electronic device, the method includes: preparing a first lead frame having a first lead, the first lead having a first portion located in a first region; electrically connecting the first lead and a first electronic part; bending the first lead such that the first portion is located outside the first region; arranging a second lead frame to overlap the first lead frame such that a second portion of a second lead of the second lead frame is located in the first region; and electrically connecting the second lead and the second electronic part.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.