Adhesive dispensing system and method using smart melt heater control
US9475083B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 22, 2015 |
| Grant date | Oct 25, 2016 |
| Priority date | — |
| Expiry date | Oct 22, 2035 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T137/6416
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An adhesive dispensing system is configured to automatically reduce the temperature of adhesive material to reduce degradation of the adhesive caused by holding the adhesive at an application temperature during periods of low throughput. To this end, a controller of the system operates a heater unit to maintain a unit set point temperature to heat and melt adhesive until a set threshold time has elapsed since the most recent supply of adhesive to the system by a fill system. Once the time elapsed since the most recent supply of adhesive exceeds the set threshold time, the heater unit is reduced in temperature to reduce the temperature of adhesive. This reduction is temperature is large enough to minimize degradation and outgassing but small enough to enable rapid warm-up times after a new supply of adhesive occurs.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.