Resin production method and resin production apparatus
US9475229B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 17, 2013 |
| Grant date | Oct 25, 2016 |
| Priority date | — |
| Expiry date | Jul 17, 2033 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29K2105/0002
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
Provided is a resin production method in which a mold release force applied between a mold and a curable resin is reduced in a resin production method using a nano-imprint method. The resin production method includes an arrangement step of arranging a curable composition (1) on a substrate (2); a contacting step of bringing a mold (3) into contact with the curable composition (1); a curable composition curing step of curing the curable composition (1) by irradiating the curable composition (1) with a radiation or heating the curable composition (1) while keeping the curable composition (1) in contact with the mold (3); a tensile stress generation step of generating a tensile stress (6) in a direction of spacing the substrate (2) and the mold (3) away from each other to such a degree that the mold (3) and the curable composition (1) are not spaced away from each other when the curable composition (1) is cured; and a mold release step of releasing the curable composition (1) and the mold (3) from each other.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.