Fixed array ACFs with multi-tier partially embedded particle morphology and their manufacturing processes
US9475963B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 14, 2015 |
| Grant date | Oct 25, 2016 |
| Priority date | — |
| Expiry date | May 14, 2035 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24893
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
An ACF comprising a substrate, a layer of an adhesive on the surface of the substrate, the adhesive optionally having conductive particles dispersed therein, at least one tier of conductive particles arranged in a non-random array, the tier being formed by transfer of conductive particles from a carrier belt having a stitching line to the surface of the adhesive layer wherein the portion of the tier corresponding to the stitching line is free of conductive particles, and the adhesive layer being overcoated with a second tier of conductive particles arranged in a non-random array at least in the area of the first tier corresponding to the stitching line. The tiers may be at the same or different depths within the adhesive layer. More than two tiers of conductive particles may be present in the ACF.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.