Copper alloy wire and copper alloy spring
US9476474B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Dec 13, 2011 |
| Grant date | Oct 25, 2016 |
| Priority date | — |
| Expiry date | Mar 24, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01B1/026
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A copper alloy wire is a filamentary material of a copper alloy containing, in percent by mass, Ni: 3.0 to 15.0%, Al: 0.5 to 5.0%, and Si: 0.1 to 3.0%, with the remainder being composed of Cu and incidental impurities, which is provided with the tensile strength (σB) of 900 to 1300 MPa and electrical conductivity of 10 to 22% IACS and, in addition to that property, satisfies an intensity ratio of A:B:C of 1.0:1.2 to 6.0:2.2 to 8.0 when A, B and C represent diffraction intensities of Cu (111), Cu (200) and Cu (220), respectively, according to an X-ray diffraction method in a predetermined cross section, and which is used for an operation or contact spring by incorporating in mobile phones and various small electronic instruments by formulating into a copper alloy spring used, particularly, for an electrical conductive spring.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.