Forming 3-D nano-particle assemblies
US9476833B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 30, 2013 |
| Grant date | Oct 25, 2016 |
| Priority date | — |
| Expiry date | Apr 27, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S977/882
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
According to an example, methods for forming three-dimensional (3-D) nano-particle assemblies include depositing SES elements onto respective tips of nano-fingers, in which the nano-fingers are arranged in sufficiently close proximities to each other to enable the tips of groups of adjacent ones of the nano-fingers to come into sufficiently close proximities to each other to enable the SES elements on the tips to be bonded together when the nano-fingers are partially collapsed. The methods also include causing the nano-fingers to partially collapse toward adjacent ones of the nano-fingers to cause a plurality of SES elements on respective groups of the nano-fingers to be in relatively close proximities to each other and form respective clusters of SES elements, introducing additional particles that are to attach onto the clusters of SES elements, and causing the clusters of SES elements to detach from the nano-fingers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.