Patent · US Active

System and method for forming microwells

US9476853B2 · kind B2 · utility

1Cited by
26References
10Claims
0Family size

Assignee

Inventors

Key dates

Filing dateDec 10, 2014
Grant dateOct 25, 2016
Priority date—
Expiry dateDec 10, 2034

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01L21/302
  • WIPO fieldMeasurement
  • WIPO sectorInstruments

Abstract

A method of forming a sensor component includes forming a first layer over a sensor pad of a sensor of a sensor array. The first layer includes a first inorganic material. The method further includes forming a second layer over the first layer. The second layer includes a polymeric material. The method also includes forming a third layer over the second layer, the third layer comprising a second inorganic material; patterning the third layer; and etching the second layer to define a well over the sensor pad of the sensor array.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.