Accelerometer and its fabrication technique
US9476903B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 19, 2013 |
| Grant date | Oct 25, 2016 |
| Priority date | — |
| Expiry date | Oct 26, 2034 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81C2203/0118
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An accelerometer, comprises, a measurement mass, a top cap silicon wafer and a bottom cap silicon wafer, which both are coupled with the said measurement mass; the measurement mass comprises a support frame, a mass, and a plurality of resilient beams; the mass and the resilient beams are located within the support frame; the mass and the support frame are connected by several sets of the resilient beams, and each set comprises two resilient folding beams; the resilient folding beams are symmetrically provided with respect to the midline of the mass; a connection beam is provided in between each set of the resilient folding beams to connect the resilient folding beams together. Silicon wafers with electrodes are bonded on the top and bottom surfaces of the measurement mass; and forms a capacitor with the measurement mass. The accelerometer in the present invention has a large mode isolation ratio, and it is symmetrical in high order vibrational modes , which further decreases the noise of the MEMS chip. Therefore, the accelerometer has the advantages of high measurement accuracy, high stability, and low noise.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.