Substrates for packaging flip-chip light emitting device and flip-chip light emitting device package structures
US9477032B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 26, 2014 |
| Grant date | Oct 25, 2016 |
| Priority date | — |
| Expiry date | Aug 26, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/857
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A substrate for packaging flip-chip light emitting device (LED) includes a substrate including a chip mount region, a first metal pattern overlapping a part of the chip mount region and disposed on the substrate, a second metal pattern disposed in a region including the chip mount region that is not overlapped with the first metal pattern, at an outer side of the first metal pattern, a third metal pattern disposed at an outer side of the second metal pattern, a first isolation line defined in a boundary between the first metal pattern and the second metal pattern, a second isolation line defined in a boundary between the second metal pattern and the third metal pattern, a lower pad disposed on a bottom of the substrate, and a via disposed to connect the first and second metal patterns to the lower pad in the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.