Thermal management solution for circuit products

US9477275B2 · kind B2 · utility

Assignee

• Intel Corporation · US

Inventors

• Arnab Choudhury · Kirkland, US
• Je-Young Chang · San Jose, US
• David W. Song · Chandler, US
• Edvin Cetegen · Chandler, US
• Ashish Gupta · San Jose, US

Key dates

• Filing date: Jan 18, 2013
• Grant date: Oct 25, 2016
• Expiry date: Apr 18, 2034

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/0002
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

An apparatus including a cold plate body; a channel module disposed within the cold plate body including a channel body and a plurality of channels projecting through the channel body; and a manifold disposed on the channel module, the manifold including an inlet and an outlet and a first plurality of apertures in fluid communication with the inlet and a second plurality of apertures are in fluid communication with the outlet. A method including introducing a fluid to an integrated cold plate disposed on an integrated circuit device, the integrated cold plate comprising a cold plate body extending about the device, the fluid being introduced into a manifold in fluid communication with a channel module disposed between the manifold and a base plate, the channel module, and including channels to direct the fluid toward the base plate, and collecting the fluid returned to the manifold.