Build platform leveling with tactile feedback
US9481134B2 · kind B2 · utility
4Cited by
2References
33Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 6, 2012 |
| Grant date | Nov 1, 2016 |
| Priority date | — |
| Expiry date | Jan 19, 2035 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02T10/82
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A three-dimensional printer uses leveling screws with tactile feedback to assist a user in properly orienting a build platform within a working volume.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.