Method of manufacturing an ink-jet printhead
US9481174B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 17, 2015 |
| Grant date | Nov 1, 2016 |
| Priority date | — |
| Expiry date | Jul 23, 2035 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J2002/14475
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A method of manufacturing an ink jet printhead includes: providing a silicon substrate including active ejecting elements; providing a hydraulic structure layer; providing a silicon orifice plate having a plurality of nozzles for ejection of said ink; and assembling the silicon substrate with said hydraulic structure layer and said silicon orifice plate. Providing the silicon orifice plate comprises: providing a silicon wafer having a substantially planar extension delimited by a first and a second surfaces; performing a thinning step at the second surface so as to remove a central portion having a preset height; and forming in the silicon wafer a plurality of through holes, each defining a respective nozzle for ejection of the ink.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.