Optical electronic device and method of fabrication
US9481572B2 · kind B2 · utility
4Cited by
8References
10Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Dec 18, 2014 |
| Grant date | Nov 1, 2016 |
| Priority date | — |
| Expiry date | Dec 18, 2034 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81C2203/0771
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
An optical electronic device and method that forms cavities through an interposer wafer after bonding the interposer wafer to a window wafer. The cavities are etched into the bonded interposer/window wafer pair using the anti-reflective coating of the window wafer as an etch stop. After formation of the cavities, the bonded interposer/window wafer pair is bonded peripherally of die areas to the MEMS device wafer, with die area micromechanical elements sealed within respectively corresponding ones of the cavities.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.