Solid PCD cutter
US9482056B2 · kind B2 · utility
7Cited by
20References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 19, 2012 |
| Grant date | Nov 1, 2016 |
| Priority date | — |
| Expiry date | Jan 16, 2034 |
Classification
- Technology area (CPC E)Fixed Constructions
- CPC primaryE21B10/54
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A cutting element may be formed by placing a plurality of diamond particles adjacent to a substrate in a reaction cell and subjecting the plurality of diamond particles to high pressure high temperature conditions to form a polycrystalline diamond body. The polycrystalline diamond body may have a cutting face area to thickness ratio ranging from 60:16 to 500:5 and at least one dimension greater than 8 mm.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.