Production of micro-mechanical devices
US9482863B2 · kind B2 · utility
5Cited by
14References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 22, 2013 |
| Grant date | Nov 1, 2016 |
| Priority date | — |
| Expiry date | Oct 22, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A method for fabrication of a device (206) from a wafer (170) of semiconductor material includes locally thinning the wafer in an area of the device to a predefined thickness by removing the semiconductor material from at least a first side of the wafer using a wet etching process, and etching through the thinned wafer in the area of the device so as to release a moving part (202) of the device. Other methods and systems for fabrication are also described.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.