Three dimensional electronic patch
US9483726B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 30, 2015 |
| Grant date | Nov 1, 2016 |
| Priority date | — |
| Expiry date | Jul 30, 2035 |
Classification
- Technology area (CPC A)Human Necessities
- CPC primaryA61B2562/164
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
A three-dimensional electronic patch includes a flat flexible circuit substrate that includes an elastic layer including a first portion and a second portion. The second portion includes at least side connected to the elastic layer and one or more sides defined by one or more cuts in the elastic layer. The three-dimensional electronic patch further includes a first sensor on the first portion of the elastic layer, a first conductive sensing pad under the first portion of the elastic layer and in electrical connection with the first sensor, and a conductive layer under the second portion of the elastic layer and in electrical connection with the first sensor. The second portion is folded to position the conductive layer away from the first portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.