Film adhesive, dicing tape with film adhesive, method of manufacturing semiconductor device, and semiconductor device
US9484240B2 · kind B2 · utility
1Cited by
2References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 19, 2014 |
| Grant date | Nov 1, 2016 |
| Priority date | — |
| Expiry date | Feb 25, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/28
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention provides a film adhesive that can prevent a thermal effect to a semiconductor wafer and that can suppress warping of the semiconductor wafer; a dicing tape with a film adhesive; and a method of manufacturing a semiconductor device.The present invention relates to a film adhesive comprising a thermoplastic resin and electrically conductive particles, the film adhesive having an adhesion strength measured at 25° C. after the film adhesive is pasted to a mirror silicon wafer at 40° C. of 0.5 N/10 mm or more.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.